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Chi Hwan Lee, PhD, is an Assistant Professor of the Weldon School of Biomedical Engineering and the School of Mechanical Engineering, both at Purdue University, where he also serves as a primary faculty member in the Center for Implantable Devices, the Center for Scalable Manufacturing, the Birck Nanotechnology Center and the Mi-Bio Center.

He is a co-founder and Chief Technology Officer at Curasis (Lafayette, IN, US), which specialises in rehabilitation sensor patch products, and serves as a scientific advisor at Omniply (Montreal, Canada), which specialises in flexible electronics products. He earned a PhD in 2013 in the Department of Mechanical Engineering at Stanford University (Stanford, CA, US). His research focuses on development of sticker-like electronics (referred to as sticktronics) for various wearable biomedical applications.

He is an author or co-author of over 40 peer-reviewed publications and six US patents.